SEOUL, Jan 13 (Reuters) - South ‌Korea's SK Hynix said ‌on Tuesday it has decided to invest 19 trillion won ($12.90 billion) to build an ‍advanced chip packaging plant in South Korea to meet rising ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

South Koreas SK Hynix is accelerating its push into the artificial intelligence semiconductor market with a major new ...