Amkor Technology isn't a household name, but it's poised to become a big winner as artificial intelligence spreads. Shares of ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in the global semiconductor supply chain.

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min The federal government is taking ...

A new technical paper titled “Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science” was published by researchers at the National ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...