Discover how Intel is enhancing its AI capabilities through innovative chip packaging technologies in New Mexico, positioning ...

TSMC has achieved yields of up to 98% to 99% for several AI products using its advanced CoWoS packaging technology, showing ...

NVIDIA is partnering with semiconductor packaging company Amkor Technology to develop advanced packaging and ...

Intel is pushing ahead with its Ohio manufacturing complex as it works toward high-volume production of its 14A process by 2031, while its EMIB-T ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Cold Chain Technologies, a portfolio company of Aurora Capital Partners, has acquired Packaging Technology Group, a provider of sustainable, curbside-recyclable thermal packaging solutions for the ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...