An addition to the 1455 series of extruded aluminum enclosures, the 1455NHD features six integral, heat-dissipating fins in the extrusion profile, to enhance cooling of enclosed electronics that ...
Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...
Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results