Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity.

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

To understand what's really happening, we need to look at the full system, specifically total cost of ownership of an AI ...

CPO integrates optical components directly into a package, replacing long copper traces with shorter connections.

How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running.

Arm is now a chip vendor—what does it mean for the semiconductor industry? EE Times’ Nitin Dahad was at the event in San ...

Minor adjustments to switching frequency, thermal management, bias power, and inductor selection improves 48V buck converter ...

NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation.

QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers.

ANC uses microphones, processors, and speakers to generate an equal and opposite signal that cancels interference in real time.

A half-wave LLC (HWLLC) platform from Renesas includes four controller ICs rated for up to 500 W for high-speed chargers.

Semtech’s TDS5311P circuit protection device delivers near-constant clamping voltage for 48-V USB PD EPR applications.